Test Connectivity

The products that enable electrical connections to be made between the tester and the device being tested.

We have extensive data sets and a deep understanding of how this industry works.

Annual analytics reports that cover test connectivity markets, suppliers, and key customer trends. They include Probe Card, Test & Burn-in Socket, and Device Interface Board (DIB) market analyses.

The Test Connectivity Advantage

Our analysts travel extensively to conferences and trade shows, and to visit the factories and offices of key players so that we can deliver the best quality of data and insights to our clients.

What's in a subscription?

Data and commentary in the reports show what’s happening, why, and how this is likely to affect your business whether you are a supplier, buyer, or investor.

  • Excel format
  • Annual and quarterly updates
  • Dedicated analyst and support

 

Probe card technologies covered:

  • Blade/Tungsten
  • Epoxy/Cantilever
  • Vertical
  • MEMS
  • Other Probe Card Technologies

Markets by application:

  • DRAM
  • NAND
  • NOR
  • Other Memory
  • CMOS Image Sensor
  • High Voltage
  • Parametric
  • RF
  • SOC, CPU, GPU, etc.
  • Other non-memory

Regions

  • China, Europe, Japan, Korea, North America, Taiwan, and Rest of World

Other information:

  • Vendor shares by probe card technology
  • Probe cards for WLCSP applications
  • Probe cards by connection type: pad, bump and pillar
  • Probe cards for flat panel display
  • Semiconductor revenues and units by device type
  • Space transformers, guide plates and probe needles
  • Industry characteristics
  • Excel format
  • Annual and quarterly updates
  • Dedicated analyst and support

 

Products covered:

  • Test sockets
  • Burn-in sockets

 

Markets by package type:

  • Through hole mount
  • Surface Mount
  • Other

 

Markets by application:

  • Memory
  • CMOS Image Sensor
  • High Voltage
  • RF
  • SOC, CPU, GPU, etc.
  • Other non-memory

 

Regions

  • China, Europe, Japan, Korea, North America, Taiwan, and Rest of World

 

Other information:

  • Vendor shares – test sockets
  • Vendor shares – burn-in sockets
  • Sockets for WLCSP applications
  • Engineering sockets vs. high volume manufacturing sockets
  • Sockets by pin type: pogo, elastomer, rigid/other
  • Semiconductor revenues and units by device type Industry characteristics
  • Excel format
  • Annual and quarterly updates
  • Dedicated analyst and support

 

Device interface board segments:

  • Board design
  • PCB manufacture

 

Markets by application:

  • Memory
  • Computing
  • Communications
  • Consumer
  • Automotive
  • Other

 

Regions

  • China, Europe, Japan, Korea, North America, Taiwan, and Rest of World

 

Other information:

  • Vendor shares – board designs
  • Vendor shares – PCB manufacture
  • Vendor shares – board design and PCB manufacture
  • Design market – captive vs. merchant
  • Semiconductor revenues and units by device type
  • Semiconductor designs
  • Industry characteristics

Make informed business decisions faster and with greater confidence