As the industry has been developing several next generation memory types, technologists are driven to accelerate development and optimize process steps on new device releases.
De-risk product planning to align with, or exceed, the development specifications of competing products.
Focused on embedded and emerging memory, provides a high level view of design quality by providing insight into memory area efficiency, the technology node for process generation, and memory capacity per die through functional analysis and benchmarking. Analysis may include process node and foundry identification, critical dimensions, functional block summary, stacked optical top metal and poly die photo delivered in CircuitVisionTM, SEM bevel and/or cross-sectional imaging
Focused on enabling understanding of all process aspects of embedded and emerging memory through dimensional, materials, architecture analysis. Also provides analyst perspective on the above to provide insight into trends and roadmap. Analysis may include SEM cross-sectional and bevel imaging, TEM cross-sectional with TEM EDS, technical trend/roadmap by technology element, interaction analysis, detailed explanation of process integrations and/or next node predictions
Requires a subscription to the Embedded & Emerging Process Analysis channel.
Provides insight into the manufacturing process steps, materials, and technology across leading edge embedded and emerging memory chips.